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  ? semiconductor components industries, llc, 2012 september, 2012 ? rev. 1 1 publication order number: ncv8870/d ncv8870 automotive grade non-synchronous boost controller the ncv8870 is an adjustable output non ? synchronous boost controller which drives an external n ? channel mosfet. the device uses peak current mode control with internal slope compensation. the ic incorporates an internal regulator that supplies charge to the gate driver. protection features include internally ? set soft ? start, undervoltage lockout, cycle ? by ? cycle current limiting, hiccup ? mode short ? circuit protection and thermal shutdown. additional features include low quiescent current sleep mode and externally ? synchronizable switching frequency. features ? peak current mode control with internal slope compensation ? 1.2 v 2% reference voltage ? fixed frequency operation ? wide input voltage range of 3.2 v to 40 vdc, 45 v load dump ? input undervoltage lockout (uvlo) ? internal soft ? start ? low quiescent current in sleep mode ? cycle ? by ? cycle current limit protection ? hiccup ? mode overcurrent protection (ocp) ? hiccup ? mode short ? circuit protection (scp) ? thermal shutdown (tsd) ? this is a pb ? free device marking diagram 8870xx = specific device code xx = 00, 01 a = assembly location l = wafer lot y = year w = work week  = pb ? free package http://onsemi.com soic ? 8 d suffix case 751 1 8 pin connections 1 8 2 3 4 7 6 5 (top view) 8870xx alyw  1 8 en/sync isns gnd gdrv vfb vc vin vdrv device package shipping ? ordering information NCV887000d1r2g soic ? 8 (pb ? free) 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. ncv887001d1r2g soic ? 8 (pb ? free) 2500 / tape & reel
ncv8870 http://onsemi.com 2 gm 8 3 2 4 6 gnd isns gdrv vin vfb 5 vdrv csa osc q d l sc temp vdrv drive logic cl scp ss fault logic clk 1 en/sync en/ sync 7 vc pwm + r c c c r sns r f1 v ref c drv r f2 v g v o c g c o figure 1. simplified block diagram and application schematic package pin descriptions pin no. pin symbol function 1 en/sync enable and synchronization input. the falling edge synchronizes the internal oscillator. the part is disabled into sleep mode when this pin is brought low for longer than the enable time ? out period. 2 isns current sense input. connect this pin to the source of the external n ? mosfet, through a current ? sense resistor to ground to sense the switching current for regulation and current limiting. 3 gnd ground reference. 4 gdrv gate driver output. connect to gate of the external n ? mosfet. a series resistance can be added from gdrv to the gate to tailor emc performance. 5 vdrv driving voltage. internally ? regulated supply for driving the external n ? mosfet, sourced from vin. bypass with a 1.0  f ceramic capacitor to ground. 6 vin input voltage. if bootstrapping operation is desired, connect a diode from the input supply to vin, in addi- tion to a diode from the output voltage to vdrv and/or vin. 7 vc output of the voltage error amplifier. an external compensator network from vc to gnd is used to stabilize the converter. 8 vfb output voltage feedback. a resistor from the output voltage to vfb with another resistor from vfb to gnd creates a voltage divider for regulation and programming of the output voltage.
ncv8870 http://onsemi.com 3 absolute maximum ratings (voltages are with respect to gnd, unless otherwise indicated) rating value unit dc supply voltage (vin) ? 0.3 to 40 v peak transient voltage (load dump on vin) 45 v dc supply voltage (vdrv, gdrv) 12 v peak transient voltage (vfb) ? 0.3 to 6 v dc voltage (vc, vfb, isns) ? 0.3 to 3.6 v dc voltage (en/sync) ? 0.3 to 6 v dc voltage stress (vin ? vdrv)* ? 0.7 to 40 v operating junction temperature ? 40 to 150 c storage temperature range ? 65 to 150 c peak reflow soldering temperature: pb ? free, 60 to 150 seconds at 217 c 265 peak c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. *an external diode from the input to the vin pin is required if bootstrapping vdrv and vin off of the output voltage. package capabilities characteristic value unit esd capability (all pins) human body model machine model  2.0  200 kv v moisture sensitivity level 1 ? package thermal resistance junction ? to ? ambient, r  ja (note 1) 100 c/w 1. 1 in 2 , 1 oz copper area used for heatsinking. device variations the ncv8870 features several variants to better fit a multitude of applications. the table below shows the typical values of parameters for the parts that are currently available. typical values part no. d max f s t ss s a v cl i src i sink v drv sce NCV887000 93% 50 khz 26 ms 15 mv/  s 400 mv 800 ma 600 ma 10.5 v y ncv887001 93% 100 khz 13 ms 33 mv/  s 400 mv 800 ma 600 ma 10.5 v y definitions symbol characteristic symbol characteristic symbol characteristic d max maximum duty cycle f s switching frequency t ss soft ? start time s a slope compensating ramp v cl current limit trip voltage i src gate drive sourcing current i sink gate drive sinking current v drv drive voltage sce short circuit enable
ncv8870 http://onsemi.com 4 electrical characteristics ( ? 40 c < t j < 150 c, 3.2 v < v in < 40 v, unless otherwise specified) min/max values are guaranteed by test, design or statistical correlation. characteristic symbol conditions min typ max unit general quiescent current, sleep mode i q,sleep v in = 13.2 v, en = 0, t j = 25 c ? 2.0 ?  a quiescent current, sleep mode i q,sleep v in = 13.2 v, en = 0, ? 40 c < t j < 125 c ? 2.0 6.0  a quiescent current, no switching i q,off into vin pin, en = 1, no switching ? 1.5 2.5 ma quiescent current, switching, normal operation i q,on into vin pin, en = 1, switching ? 3.0 6.0 ma oscillator minimum pulse width t on,min 200 250 300 ns maximum duty cycle d max NCV887000 ncv887001 91 91 93 93 95 95 % switching frequency f s NCV887000 ncv887001 45 90 50 100 55 110 khz soft ? start time t ss from start of switching with v fb = 0 until reference voltage = v ref NCV887000 ncv887001 21 10.5 26 13 31 15.5 ms soft ? start delay t ss,dly from en 1 until start of switching with v fb = 0 ? 720 840  s slope compensating ramp s a NCV887000 ncv887001 12 28 15 33 18 38 mv/  s enable/synchronization en/sync pull ? down current i en/sync v en/sync = 5 v ? 5.0 10  a en/sync input high voltage v s,ih 2.0 ? 5.0 v en/sync input low voltage v s,il 0 ? 800 mv en/sync time ? out ratio %t en from sync falling edge, to oscillator con- trol (en high) or shutdown (en low), per- cent of typical switching period ? ? 350 % sync minimum frequency ratio %f sync,min percent of f s ? ? 80 % sync maximum frequency f sync,max 1.1 ? ? mhz synchronization delay t s,dly from sync falling edge to gdrv falling edge ? 50 100 ns synchronization duty cycle d sync 25 ? 75 % current sense amplifier low ? frequency gain a csa input ? to ? output gain at dc, isns  1 v 0.9 1.0 1.1 v/v bandwidth bw csa gain of a csa ? 3 db 2.5 ? ? mhz isns input bias current i sns,bias out of isns pin ? 30 50  a current limit threshold voltage v cl voltage on isns pin NCV887000 ncv887001 360 360 400 400 440 440 mv current limit, response time t cl cl tripped until gdrv falling edge, v isns = v cl + 40 mv ? 80 125 ns overcurrent protection, threshold voltage %v ocp percent of v cl 125 150 175 % overcurrent protection, response time t ocp from overcurrent event, until switching stops, v isns = v ocp + 40 mv ? 80 125 ns
ncv8870 http://onsemi.com 5 electrical characteristics ( ? 40 c < t j < 150 c, 3.2 v < v in < 40 v, unless otherwise specified) min/max values are guaranteed by test, design or statistical correlation. characteristic unit max typ min conditions symbol voltage error operational transconductance amplifier transconductance g m,vea v fb ? v ref = 20 mv 0.8 1.2 1.5 ms vea output resistance r o,vea 2.0 ? ? m  vfb input bias current i vfb,bias current out of vfb pin ? 0.5 2.0  a reference voltage v ref 1.176 1.200 1.224 v vea maximum output voltage v c,max 2.5 ? ? v vea minimum output voltage v c,min ? ? 0.3 v vea sourcing current i src,vea vea output current, vc = 2.0 v 80 100 ?  a vea sinking current i snk,vea vea output current, vc = 0.7 v 80 100 ?  a gate driver sourcing current i src v drv 6 v, v drv ? v gdrv = 2 v NCV887000 ncv887001 600 600 800 800 ? ? ma sinking current i sink v gdrv 2 v NCV887000 ncv887001 500 500 600 600 ? ? ma driving voltage dropout v drv,do v in ? v drv , iv drv = 10 ma ? 0.2 0.35 v driving voltage source current i drv v in ? v drv = 1 v 10 15 ? ma backdrive diode voltage drop v d,bd v drv ? v in , i d,bd = 5 ma ? ? 0.7 v driving voltage v drv i vdrv = 0.1 ? 25 ma NCV887000 ncv887001 10 10 10.5 10.5 11 11 v uvlo undervoltage lock ? out, threshold voltage v uvlo v in falling 3.0 3.1 3.2 v undervoltage lock ? out, hysteresis v uvlo,hys v in rising 50 125 200 mv short circuit protection startup blanking period %t scp,dly from start of soft ? start, percent of t ss 100 120 150 % hiccup ? mode period %t hcp,dly from shutdown to start of soft ? start, percent of t ss 65 80 95 % short circuit threshold voltage %v scp v fb as percent of v ref 60 67 75 % short circuit delay t scp from v fb < v scp to stop switching ? 35 100 ns thermal shutdown thermal shutdown threshold t sd t j rising 160 170 180 c thermal shutdown hysteresis t sd,hys t j falling 10 15 20 c thermal shutdown delay t sd,dly from t j > t sd to stop switching ? ? 100 ns
ncv8870 http://onsemi.com 6 typical performance characteristics 010203040 v in , input voltage (v) figure 2. sleep current vs. input voltage i q,sleep , sleep current (  a) t j = 25 c t j , junction temperature ( c) figure 3. sleep current vs. temperature ? 50 0 50 100 20 0 t j , junction temperature ( c) figure 4. quiescent current vs. temperature t on,min minimum on time (ns) t j , junction temperature ( c) figure 5. minimum on time vs. temperature t j , junction temperature ( c) figure 6. normalized current limit vs. temperature ? 40 10 60 110 160 normalized current limit (25 c) i q,sleep , sleep current (  a) v in = 13.2 v i q,on , quiescentcurrent (ma) v in = 13.2 v 0 1 2 3 4 5 6 236 238 240 242 244 246 248 250 252 3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 150 f s = 100 khz f s = 50 khz ? 50 0 50 100 200 150 ? 50 0 50 100 20 0 150 0.990 0.995 1.000 1.005 1.010 0 1 2 3 4 5 7 6 t j , junction temperature ( c) figure 7. reference voltage vs. temperature v ref , reference voltage (v) ? 40 10 60 110 16 0 1.195 1.197 1.199 1.201 1.205 1.203
ncv8870 http://onsemi.com 7 typical performance characteristics figure 8. enable pulldown current vs. voltage t j , junction temperature ( c) figure 9. enable pulldown current vs. temperature i enable , pulldown current (  a) 01234 v enable , voltage (v) i enable , pulldown current (  a) t j = 25 c 56 ? 40 10 60 110 160 0 1 2 3 4 5 7 6 5.0 5.5 6.0 6.5 7.0 7.5 8.0
ncv8870 http://onsemi.com 8 theory of operation figure 10. current mode control schematic oscillator slope compensation q s r ncv8870 voltage error vea csa pwm comparator gate drive compensation v in l i sns gdrv c o r l v fb v out ? + + ? + ? + current mode control the ncv8870 incorporates a current mode control scheme, in which the pwm ramp signal is derived from the power switch current. this ramp signal is compared to the output of the error amplifier to control the on ? time of the power switch. the oscillator is used as a fixed ? frequency clock to ensure a constant operational frequency. the resulting control scheme features several advantages over conventional voltage mode control. first, derived directly from the inductor, the ramp signal responds immediately to line voltage changes. this eliminates the delay caused by the output filter and the error amplifier, which is commonly found in voltage mode controllers. the second benefit comes from inherent pulse ? by ? pulse current limiting by merely clamping the peak switching current. finally, since current mode commands an output current rather than voltage, the filter offers only a single pole to the feedback loop. this allows for a simpler compensation. the ncv8870 also includes a slope compensation scheme in which a fixed ramp generated by the oscillator is added to the current ramp. a proper slope rate is provided to improve circuit stability without sacrificing the advantages of current mode control. current limit the ncv8870 features two current limit protections, peak current mode and over current latch off. when the current sense amplifier detects a voltage above the peak current limit between isns and gnd after the current limit leading edge blanking time, the peak current limit causes the power switch to turn off for the remainder of the cycle. set the current limit with a resistor from isns to gnd, with r = v cl / i limit . if the voltage across the current sense resistor exceeds the over current threshold voltage the device enters over current hiccup mode. the device will remain off for the hiccup time and then go through the soft ? start procedure. short circuit protection if the short circuit enable bit is set (sce = y) the device will attempt to protect the power mosfet from damage. when the output voltage falls below the short circuit trip voltage, after the initial short circuit blanking time, the device enters short circuit latch off. the device will remain off for the hiccup time and then go through the soft ? start. en/sync the enable/synchronization pin has three modes. when a dc logic high (cmos/ttl compatible) voltage is applied to this pin the ncv8870 operates at the programmed frequency. when a dc logic low voltage is applied to this pin the ncv8870 enters a low quiescent current sleep mode. when a square wave of at least %f sync,min of the free running switching frequency is applied to this pin, the switcher operates at the same frequency as the square wave. if the signal is slower than this, it will be interpreted as enabling and disabling the part. the falling edge of the square wave corresponds to the start of the switching cycle. if device is disabled, it must be disabled for 7 clock cycles before being re ? enabled. uvlo input undervoltage lockout (uvlo) is provided to ensure that unexpected behavior does not occur when vin is too low to support the internal rails and power the controller. the ic will start up when enabled and vin surpasses the uvlo threshold plus the uvlo hysteresis
ncv8870 http://onsemi.com 9 and will shut down when vin drops below the uvlo threshold or the part is disabled. internal soft ? start to insure moderate inrush current and reduce output overshoot, the ncv8870 features a soft start which charges a capacitor with a fixed current to ramp up the reference voltage. this fixed current is based on the switching frequency, so that if the ncv8870 is synchronized to twice the default switching frequency the soft start will last half as long. vdrv an internal regulator provides the drive voltage for the gate driver. bypass with a ceramic capacitor to ground to ensure fast turn on times. the capacitor should be between 0.1  f and 1  f, depending on switching speed and charge requirements of the external mosfet. application information design methodology this section details an overview of the component selection process for the ncv8870 in continuous conduction mode boost. it is intended to assist with the design process but does not remove all engineering design work. many of the equations make heavy use of the small ripple approximation. this process entails the following steps: 1. define operational parameters 2. select current sense resistor 3. select output inductor 4. select output capacitors 5. select input capacitors 6. select feedback resistors 7. select compensator components 8. select mosfet(s) 9. select diode 1. define operational parameters before beginning the design, define the operating parameters of the application. these include: v in(min) : minimum input voltage [v] v in(max): maximum input voltage [v] v out : output voltage [v] i out(max) : maximum output current [a] i cl : desired typical cycle-by-cycle current limit [a] from this the ideal minimum and maximum duty cycles can be calculated as follows: d min  1  v in(max) v out d max  1  v in(min) v out both duty cycles will actually be higher due to power loss in the conversion. the exact duty cycles will depend on conduction and switching losses. if the maximum input voltage is higher than the output voltage, the minimum duty cycle will be negative. this is because a boost converter cannot have an output lower than the input. in situations where the input is higher than the output, the output will follow the input, minus the diode drop of the output diode and the converter will not attempt to switch. if the calculated d max is higher the d max of the ncv8870, the conversion will not be possible. it is important for a boost converter to have a restricted d max , because while the ideal conversion ration of a boost converter goes up to infinity as d approaches 1, a real converter?s conversion ratio starts to decrease as losses overtake the increased power transfer. if the converter is in this range it will not be able to regulate properly. if the following equation is not satisfied, the device will skip pulses at high v in : d min f s  t on(min) where: f s : switching frequency [hz] t on(min) : minimum on time [s] 2. select current sense resistor current sensing for peak current mode control and current limit relies on the mosfet current signal, which is measured with a ground referenced amplifier. the easiest method of generating this signal is to use a current sense resistor from the source of the mosfet to device ground. the sense resistor should be selected as follows: r s  v cl i cl where: r s : sense resistor [  ] v cl : current limit threshold voltage [v] i cl : desire current limit [a] 3. select output inductor the output inductor controls the current ripple that occurs over a switching period. a high current ripple will result in excessive power loss and ripple current requirements. a low current ripple will result in a poor control signal and a slow current slew rate in case of load steps. a good starting point for peak to peak ripple is around 10% of the inductor current at the maximum load at the worst case v in , but operation should be verified empirically. the worst case v in is half of v out , or whatever v in is closest to half of v in . after choosing a peak current ripple value, calculate the inductor value as follows: l  v in(wc) 2 d wc  i l,max f s v out where: v in(wc) : v in value as close as possible to half of v out [v] d wc : duty cycle at v in(wc)  i l,max : maximum peak to peak ripple [a]
ncv8870 http://onsemi.com 10 the maximum average inductor current can be calculated as follows: i l,avg  v out i out(max) v in(min) the peak inductor current can be calculated as follows: i l,peak  i l,avg  v in(min) 2 d max l f s v out where: i l,peak : peak inductor current value [a] 4. select output capacitors the output capacitors smooth the output voltage and reduce the overshoot and undershoot associated with line transients. the steady state output ripple associated with the output capacitors can be calculated as follows: i out(max)  v out  v in(min)   c out f  2  i out(max) v out r esr v in(min) v out(ripple)  the capacitors need to survive an rms ripple current as follows: i cout(rms)  i out v out  v in(min) v in(min) the use of parallel ceramic bypass capacitors is strongly encouraged to help with the transient response. 5. select input capacitors the input capacitor reduces voltage ripple on the input to the module associated with the ac component of the input current. i cin(rms)  v in(wc) 2 d wc l f s v out 23 6. select feedback resistors the feedback resistors form a resistor divider from the output of the converter to ground, with a tap to the feedback pin. during regulation, the divided voltage will equal v ref . the lower feedback resistor can be chosen, and the upper feedback resistor value is calculated as follows: r upper  r lower  v out  v ref  v ref the total feedback resistance (r upper + r lower ) should be in the range of 1 k  ? 100 k  . 7. select compensator components current mode control method employed by the ncv8870 allows the use of a simple, t ype ii compensation to optimize the dynamic response according to system requirements. 8. select mosfet(s) in order to ensure the gate drive voltage does not drop out the mosfet(s) chosen must not violate the following inequality: q g(total)  i drv f s where: q g(total) : total gate charge of mosfet(s) [c] i drv : drive voltage current [a] f s : switching frequency [hz] the maximum rms current can be calculated as follows: i d(max)  i out d d
the maximum voltage across the mosfet will be the maximum output voltage, which is the higher of the maximum input voltage and the regulated output voltaged: v q(max)  v out(max) 9. select diode the output diode rectifies the output current. the average current through diode will be equal to the output current: i d(avg)  i out(max) additionally, the diode must block voltage equal to the higher of the output voltage and the maximum input voltage: v d(max)  v out(max) the maximum power dissipation in the diode can be calculated as follows: p d  v f (max) i out(max) where: p d : power dissipation in the diode [w] v f(max) : maximum forward voltage of the diode [v] low voltage operation if the input voltage drops below the uvlo or mosfet threshold voltage, another voltage may be used to power the device. simply connect the voltage you would like to boost to the inductor and connect the stable voltage to the vin pin of the device. in boost configuration, the output of the converter can be used to power the device. in some cases it may be desirable to connect 2 sources to vin pin, which can be accomplished simply by connecting each of the sources through a diode to the vin pin.
ncv8870 http://onsemi.com 11 package dimensions soic ? 8 nb case 751 ? 07 issue ak seating plane 1 4 5 8 n j x 45  k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m  1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155  mm inches  scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. ncv8870/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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